Processes for rapidly and accurately measuring the coefficient of moisture expansion for materials, such as adhesives, are disclosed. A replication technique may be used to manufacture highly flat and smooth adhesive samples. Moisture is introduced in a controlled humidity atmosphere, distortion is monitored with an accurate laser interferometer (e.g., ˜1 nanometer (nm) accuracy), and measurements are correlated with moisture content change. Such processes decrease sample size by three orders of magnitude as compared with conventional techniques and have a smaller adhesive mass requirement, which enables measurement of expensive microelectronic adhesives that were previously cost-prohibitive to measure. Also, thinner films allow CME measurements of ultraviolet (UV) cured adhesives that would otherwise have depth of penetration issues. Furthermore, saturation occurs quickly, allowing pre-stabilization at room temperature, which enabled parametric studies as a function of processing or cure state. Additionally, testing occurs within hours versus months, enabling short lead times for root-cause investigations.
Process for rapidly measuring coefficient of moisture expansion (CME) values for materials
Process for rapidly measuring coefficient of moisture expansion (CME) values for materials
Issue
Date
Patent No.
US 11,940,266 B2
Category
Method or Process (e.g. a way to accomplish a given result)
Keywords: adhesive, Moisture
International Class: G01B11/24, G01N21/84, G06T7/00, G06T7/64