A material modification assembly comprises an energy source for generating light beams to modify a substrate. A computing device generates pattern script(s) based on at least one parameter of the modification. The computing device also generates process script(s) including a type of pulse scripts to be used with the light beams and are based on at least one parameter of the interaction between the energy source and the substrate. The computing device combines the pattern script(s) with the process script(s) and generates command signals based on the combination. The computing device transmits the command signals to one or more additional devices of the material modification assembly to facilitate modifying the light beams for the modification to the substrate such that the modification includes a pattern on at least a surface of the substrate having dimensions and includes two or more discrete material alterations or changes spatially overlapped within the pattern.
Material modification assembly and method for use in the modification of material substrates
Material modification assembly and method for use in the modification of material substrates
Issue
Date
Publication Date
Patent No.
10,228,666
Category
Device and Method
Keywords: laser, laser etching
International Class: G05B 19/37 (20060101), G05B 15/02 (20060101), A61F 2/30 (20060101)