Method of improving dimensional stability and adhesive strength of bonded structures

A method of accelerating the reduction of residual stress in a bonded structure is provided. The method can include: providing a bonded structure having at least two substructures, wherein the substructures are bonded together with an adhesive; and submitting the bonded structure to a high-humidity environment having a relative humidity of at least 75%. The method can also include a step of submitting the bonded structure to an low-humidity environment having a relative humidity of at most 20%. According to the method, the bonded structure can have a first residual stress at a first time and a second residual stress at a second time, wherein an absolute value of the first residual stress is greater than an absolute value of the second residual stress. According to the method, the residual stress at the second time can be about zero.