Three-D (3-D) Patterning of Electrical Conduction Paths within an Encapsulating Glass/Ceramic Package

Issue
 Date
Publication Date
Patent No.
9,073,258
Category
Method or Process

A photostructurable ceramic is processed using photostructuring process steps for embedding devices within a photostructurable ceramic volume, the devices may include one or more of chemical, mechanical, electronic, electromagnetic, optical, and acoustic devices, all made in part by creating device material within the ceramic or by disposing a device material through surface ports of the ceramic volume, with the devices being interconnected using internal connections and surface interfaces.

Keywords: MEMs, laser etching, photostructured, acoustic
International Class: H04R31/00, B01J19/00, B29C67/00, B41J2/00, B81C1/00, C03C23/00, G03F7/00, B01L3/00